Wafer Process – Dispense Edge Seal with Volumetric PCD Technology by GPD Global

http://www.gpd-global.com Discover dispense edge seal with Truly Volumetric Dispense Technology – Progressive Cavity Displacement (PCD). Input cassette – alignment process – place wafer in a dispenser – dispense edge seal – heating and cooling – output cassett. A must to watch.

GPD Global uses its Volumetric PCD Technology and MAX Series Dispenser for wafer edge sealing process. More information: http://www.gpd-global.com/co_website/fluiddispense-appsol-wafer.php

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Post time: 12-12-2017